Xnovation Packaging | Secured Wafer Complete Backend Processing Solutions

A Domestic Minority-Owned Enterprise

Technology Partner

Shore to Shore Capabilities

QFN | Copper Clip | Power SIP | TSV & Stacked | Power MCM & Hybrid Technology

Probe | 2 Auto | Manual Probing

Dicing (Disco Saw)

Pick & Place | Die Attach | Wire Bond

Prototype Packages

Custom Packages | Package Innovation | Hybrid Innovation

Electronic Testers

Xnovation

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